- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
Patent holdings for IPC class H01L 23/58
Total number of patents in this class: 2429
10-year publication summary
|
200
|
180
|
212
|
202
|
176
|
181
|
128
|
110
|
165
|
42
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
469 |
| Samsung Electronics Co., Ltd. | 131630 |
114 |
| Intel Corporation | 45621 |
70 |
| Renesas Electronics Corporation | 6305 |
62 |
| Infineon Technologies AG | 8189 |
56 |
| International Business Machines Corporation | 60644 |
49 |
| Texas Instruments Incorporated | 19376 |
49 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
43 |
| United Microelectronics Corp. | 3921 |
38 |
| Mitsubishi Electric Corporation | 43934 |
37 |
| Kioxia Corporation | 9847 |
33 |
| Micron Technology, Inc. | 24960 |
32 |
| Qualcomm Incorporated | 76576 |
31 |
| Semiconductor Components Industries, L.L.C. | 5345 |
29 |
| Fuji Electric Co., Ltd. | 4750 |
25 |
| Samsung Display Co., Ltd. | 30585 |
24 |
| SK Hynix Inc. | 11030 |
23 |
| Rohm Co., Ltd. | 5843 |
22 |
| NXP USA, Inc. | 4155 |
20 |
| Infineon Technologies Austria AG | 1954 |
16 |
| Other owners | 1187 |